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Android Arm System On Module SoM RK3568 LCB3568 64bit Cortex A55

Product Details

Place of Origin: Shanghai, China

Brand Name: Neardi

Model Number: LCB3568

Payment & Shipping Terms

Minimum Order Quantity: 1 piece

Price: Negotiable

Packaging Details: 33.5×19×9 cm

Delivery Time: 7 days

Payment Terms: L/C, D/A, D/P, T/T

Supply Ability: 10000/pieces/mon

Get Best Price
Product Details
Highlight:

Android arm System On Module SoM

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64bit System On Module SoM

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Cortex A55 arm som

SoC:
RK3568
Supplier Type:
OEM/ODM
CPU:
22nm Process, Quad-core 64-bit Cortex-A55, With A Maximum Clock Speed Of 2.0GHz.
GPU:
ARM G52 2EE, Supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, And Has A High-quality 2D Graphics Engine Built-in.
NPU:
1 TOPS
VPU:
4K/1080P
DDR:
LPDDR4 , With Options For 1GB/2GB/4GB/8GB (Optional).
EMMC:
EMMC 5.1, With Options For 8GB/16GB/32GB/64GB/128GB (Optional).
Working Temperature:
Enterprise Grade: -20°C To 70°C Industrial Grade: -40°C To 85°C
PCB Interface:
B2B, 320 Pin
Embedded:
Yes
OS:
Android / Ubuntu / Buildroot / Debian
Application:
Industrial Automation
SoC:
RK3568
Supplier Type:
OEM/ODM
CPU:
22nm Process, Quad-core 64-bit Cortex-A55, With A Maximum Clock Speed Of 2.0GHz.
GPU:
ARM G52 2EE, Supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, And Has A High-quality 2D Graphics Engine Built-in.
NPU:
1 TOPS
VPU:
4K/1080P
DDR:
LPDDR4 , With Options For 1GB/2GB/4GB/8GB (Optional).
EMMC:
EMMC 5.1, With Options For 8GB/16GB/32GB/64GB/128GB (Optional).
Working Temperature:
Enterprise Grade: -20°C To 70°C Industrial Grade: -40°C To 85°C
PCB Interface:
B2B, 320 Pin
Embedded:
Yes
OS:
Android / Ubuntu / Buildroot / Debian
Application:
Industrial Automation
Product Description
Neardi System On Module RK3568 Computer on Modules LCB3568 Arm Som Ubuntu

The LCB3568, based on Rockchip’s RK3568 series platform, offers full functionality in a compact form factor of 60mm x 40mm. It connects to the baseboard using four dual-slot 0.5mm pitch 80Pin connectors and is secured with four M2 screws, ensuring robust and reliable operation, as well as simple installation and maintenance.

 

The module includes a CPU (RK3568 or RK3568J), LPDDR4 memory available in 1GB, 2GB, or 4GB configurations, and eMMC 5.1 storage with options ranging from 4GB to 128GB. Its power management system combines the RK809 with DC-DC and LDO components, supporting DVFS to optimize voltage and frequency performance.

 

Designed with modularity in mind, the LCB3568 exposes all functional pins of the CPU, rigorously tested for reliability. This approach helps developers reduce project timelines, cut costs, and enhance operational efficiency, making it an efficient and dependable solution for a variety of applications.

 
Product Parameters
 
Function Description
CPU RK3568, 22nm process, quad-core 64-bit Cortex-A55, with a maximum clock speed of 2.0GHz.
GPU

ARM G52 2EE, supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1,

and has a high-quality 2D graphics engine built-in.

NPU Offers up to 1 TOPS of computational power; supports hybrid operations of
INT8/INT16/FP16/BFP16 MAC; compatible with deep-learning frameworks
such as TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, and Darknet.
VPU

Capable of 4K VP9 and 4K H265 video decoding at up to 60fps.

Capable of 1080P H265/H264 video encoding at up to 100fps.

Equipped with an 8M ISP with HDR capabilities.

DDR LPDDR4 RAM, with options for 1GB/2GB/4GB/8GB (Optional).
eMMC eMMC 5.1 storage, with options for 8GB/16GB/32GB/64GB/128GB (Optional).
PMU RK806
OS Android / Ubuntu / Buildroot / Debian
Camera Interface Compatible with the MIPI Alliance Interface specification v1.2
Up to 4 data lanes, 2.5Gbps maximum data rate per lane
One interface with 1 clock lane and 4 data lanes
Two interface, each with 1 clock lane and 2 data lanes
Support up to 16bit DVP interface (digital parallel input)
Support ISP block(Image Signal Processor)
Display Interface RGB/ BT656/BT1120/ MIPI_DSI_V1.2/ LVDS/ HDMI2.0/Edp1.3/ EBC
Support three simultaneous displays
HDR10/HDR HLG/ HDR2SDR/SDR2HDR
3D-LUT/P2I/CSC/BCSH/DITHER/CABC/GAMMA/COLOR BAR
USB Interface 1 x USB3.0 HOST, 1 x USB3.0 OTG, 2 x USB2.0 HOST
PCIe3.0 PHY Interface Support PCIe3.1(8Gbps) protocol and backward compatible with the PCIe2.1 and PCIe1.1 protocol
Support two lane
Support two PCIe controller with x1 mode or one PCIe controller with x2 mode
Dual operation mode: Root Complex(RC)and End Point(EP)
Multi-PHY Interface Support three multi-PHYs with PCIe2.1/SATA3.0/USB3.0/QSGMII controller
USB3 Host controller + USB3 OTG controller
PCIe2.1 controller / three SATA controller
Audio Interface I2S0 with 8 channel TX and RX
I2S1 with 8 channel TX and RX
I2S2/I2S3 with 2 channel TX and RX
PDM with 8channel
TDM supports up to 8 channels for TX and 8 channels RX path
Connectivity Compatible with SDIO 3.0 protocol
GMAC 10/100/1000M Ethernet Controller
Four on-chip SPI controllers
Ten on-chip UART controllers inside
Six on-chip I2C controllers
Smart Card with ISO-7816
Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation
Multiple groups of GPIO
8 single-ended input channels SARADC with 10bits resolution up to 1MS/s
sampling rate
Operating temperature Enterprise Grade: -20°C to 70°C
Industrial Grade: -40°C to 85°C
PCB interface  B2B,320 Pin
PCB layers  10 layers
PCB size L* W *H(mm):60 *40 * 7.8(PCB thickness 1.6mm)
 
Developer's Must-Read!
 
Welcome to our Resource Center, where you can find various helpful links and information for developers.
Please visit the corresponding Wiki documentation link to obtain detailed information about the product of your choice, including the following: Hardware information: Specifications, components, and technical parameters of the product debugging Methods: Common troubleshooting steps and debugging techniques. Interface Information: Available interfaces and their functional descriptions.Firmware Programming: Guidance on firmware updates and programming processesCompiling SDK: Detailed instructions for compiling and configuring the SDK.Linux and Android Development: Development guidelines and best practices for Linux and Android environments.

 

 
Company Introduction
 
Shanghai Neardi Technology Co., Ltd. was established in 2014, focusing on the field of intelligent electronic products, providing customers with one-stop solutions for design and production. The company adheres to the strategy of technological innovation and professional service, integrates the technical precipitation and industry experience of Neardi Technology, helps partners to introduce products to the market quickly and efficiently, effectively saves customers' time and resources, and becomes the product accelerator of partners.
Android Arm System On Module SoM RK3568 LCB3568 64bit Cortex A55 0
 
After-sale Service Policy

1. Please take a valid purchasing voucher for maintenance requests when you have product failure problems.
2. We kindly provide one year of warranty to the ARM board except for non-warranty components(CPU, RAM, and Flash/ storage chips) and a three-month warranty to display and power adapter from the ex-factory date.
3. Product failure in expired time, we kindly provide paid maintenance service. Charges depend on the assessment by the maintenance department. If goods are seriously damaged, the accessory is discontinued, or other uncontrollable conditions may cause the products can not be fixed, Neardi will not provide maintenance service.
4. Neardi kindly provides one month of warranty for the repaired items, payment should be made to the appointed account. Note: This warranty is only valid for the repaired problem.
5. Please take necessary data backup before the defective item is sent back up for maintenance, all risks caused by no backup should be borne by customers.
6. Neardi will reject items sent back without our permission.
7. To goods within the warranty period, freight should be shared by both sides, otherwise, the customer should bear all maintenance-related freight and customs fees.
Non-warranty Coverage(Paid Maintenance Service):
1. Products out of warranty period;
2. Non-warranty components including CPU, RAM, and Flash chips;
3. Failure caused by improper operations like PCB short circuit, rupture;
4. Bar code or factory ID tampered or other operations cause the products can not be recognized;
5. The bar code or factory ID on the purchasing voucher is not matched with the product itself;
6. Product failure caused by unauthorized maintenance, improper operations, misuse operations, or other unexpected behaviors.
7. Product failure caused by force majeure.
8. Other failures caused during delivery.