Shanghai Neardi Technology Co., Ltd. sales@neardi.com +86 17612192553
Product Details
Place of Origin: Shanghai, China
Brand Name: Neardi
Model Number: LCB3399pro
Payment & Shipping Terms
Minimum Order Quantity: 1 piece
Price: Negotiable
Packaging Details: 33.5×19×9 cm
Delivery Time: 7 days
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 10000/pieces/mon
SoC: |
RK3399Pro |
Supplier Type: |
OEM/ODM |
CPU: |
2 * Cortex-A72 + 4 * Cortex-A53 |
GPU: |
Mali-T860MP4 GPU |
NPU: |
3 TOPS |
VPU: |
4K/1080P |
DDR: |
LPDDR4, 3GB/6GB (Optional) |
EMMC: |
EMMC 5.1, 16GB/64GB (Optional) |
Working Temperature: |
Enterprise Grade: -20°C To 70°C; Industrial Grade: -40°C To 85°C |
PCB Interface: |
B2B, 240 Pin |
Embedded: |
Yes |
OS: |
Android / Ubuntu / Buildroot / Debian |
Application: |
Smart Home And Retail |
SoC: |
RK3399Pro |
Supplier Type: |
OEM/ODM |
CPU: |
2 * Cortex-A72 + 4 * Cortex-A53 |
GPU: |
Mali-T860MP4 GPU |
NPU: |
3 TOPS |
VPU: |
4K/1080P |
DDR: |
LPDDR4, 3GB/6GB (Optional) |
EMMC: |
EMMC 5.1, 16GB/64GB (Optional) |
Working Temperature: |
Enterprise Grade: -20°C To 70°C; Industrial Grade: -40°C To 85°C |
PCB Interface: |
B2B, 240 Pin |
Embedded: |
Yes |
OS: |
Android / Ubuntu / Buildroot / Debian |
Application: |
Smart Home And Retail |
The LCB3399Pro is a full-featured core module exquisitely designed based on the Rockchip RK3399Pro chip platform, with dimensions of only 75mm by 55mm. The connection between the core module and the baseboard uses two Tyco/AMP 0.8mm pitch dual-row 140Pin board-to-board connectors, secured with four M3 screws, ensuring stability, reliability, ease of installation, and maintenance. The LCB3399Pro includes a CPU (with integrated NPU), DDR, eMMC, and PMU components. The CPU is the RK3399 Pro; DDR uses the market mainstream LPDDR3, with dual-channel 64-bit bandwidth, lower power consumption, and higher frequency, available in 3GB/6GB configurations; eMMC adopts the high-speed eMMC 5.1 standard, with various capacity configurations from 4GB to 128GB; the PMU consists of the RK809 and multiple DC-DC and LDO components, with CPU core voltages supporting DVFS (Dynamic Voltage and Frequency Scaling).
The LCB3399Pro has undergone a rigorous testing process management to ensure long-term stable and reliable operation. It can provide customers with the following test data for reference: functional item testing, accuracy, ripple, overshoot, drop, rise time, and dynamic range testing of power supply voltage, power-up sequence testing of various voltages, accuracy and frequency deviation testing of key clock signals, power consumption testing under full load, and temperature rise testing under full load.
The LCB3399Pro adopts a modular design concept, designing the core part, which has the same requirements and strict standards, as a full-function module, and has undergone comprehensive testing and mass verification. Users can develop products based on this module, saving project development time, reducing corporate costs, and
improving company efficiency
Function | Description |
CPU | RK3399Pro; dual-core Cortex-A72 + quad-core Cortex-A53 architectural processor. |
GPU |
Mali-T860MP4 GPU, supporting OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DirectX 11; supports AFBC (Advanced Frame Buffer Compression). |
NPU | 3 TOPS computational power; supports 8-bit/16-bit operations; compatible with TensorFlow and Caffe models. |
VPU | Capable of 4K VP9 and 4K 10-bit H265/H264 video decoding, up to 60fps at 1080P; multi-format video decoding (WMV, MPEG-1/2/4, VP8); 1080P video encoding, supporting H.264 and VP8 formats |
DDR | LPDDR4/LPDDR4X, with options for 3GB or 6GB. |
eMMC | eMMC 5.1, with options for 16GB,64GB |
PMU | RK806 |
Camera Interface | Two ISP built-in Dual MIPI-CSI 4 Lane of 1.5 Gbps/Lane ITU-R BT 601/656 compliant Maximum input resolution of one ISP is 14M pixels |
Display Interface | Two VOP embedded Dual MIPI-DSI 4 Lane of 1.5 Gbps/Lane up to 2560x1600@60fps eDP1.3 4 Lane of 2.7/1.62 Gbps/lane DP1.2 4 Lane with HDCP2.2 up to 4kx2k at 60Hz resolution HDMI2.0 3 Lane with HDCP2.2 |
USB Interface | OTG*1,HOST*2,TYPE-C*2 |
TYPE-C Interface | Dual Type-C PHY with Type-C V1.1 and USB PD2.0 Attach/detach detection and signaling as DFP, UFP and DRP Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode Up to 5Gbps data rate for USB3.0 Up to 5.4Gbps (HBR2) data rate for DP1.2 |
Audio Interface | Three I2S/PCM built-in SPDIF supported Audio resolution from 16bits to 32bits Sample rate up to 192KHz Provides master and slave work mode, software configurable Support 3 I2S formats (normal, left-justified, right-justified) Support 4 PCM formats (early, late1, late2, late3) Support two 16-bit audio data store together in one 32-bit wide location Support 16, 20, 24 bits audio data transfer in linear PCM mode |
Connectivity | Compatible with SDIO 3.0 protocol GMAC 10/100/1000M Ethernet Controller Six on-chip SPI controllers Five on-chip UART controllers inside Nine on-chip I2C controllers Five groups of GPIO (GPIO0~GPIO4), totally have 122 GPIOs One PCIe port compatible with PCI Express V2.1 and dual operation mode (RC and EP)Six-channel single-ended 10-bit SAR-ADC up to 1MS/s sampling rate |
OS | Android / Ubuntu / Buildroot / Debian |
PCB interface | B2B(280 Pin 0.8mm Pitch) |
PCB size | L* W *H(mm):75 *55 * 7.8(PCB thickness 1.2mm) |
Wiki Documentation: | http://wiki.neardi.net/docs/welcome |
GitHub: | https://github.com/neardiGitLab: https://gitlab.com/neardiSDK |
Repository: | https://gitlab.com/neardi-linux |
Forum: | https://forum.neardi.com |
Video Tutorials: | https://www.youtube.com/@neardichannels |
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